The Dye&Pry Test is a useful technique in which a dye penetrant material is used to inspect for interconnect failures in Integrated Circuits (IC). This is commonly done on solder joints for Ball Grid Array (BGA) components, although in some cases it can be done with other components or samples. The component of interest is submerged in a dye material, such as red steel dye, and placed under vacuum. This allows the dye to flow underneath the component and into any cracks or defects. The dye is then dried in an oven (preferably overnight) to prevent smearing during separation, which could lead to false results. The part of interest is mechanically separated from the Printed Circuit Board (PCB) and inspected for the presence of dye. Any fracture surface or interface will have dye present, indicating the presence of cracks or open circuits. IPC-TM-650 Method 2.4.53 specifies the process for Dye&Pry.