Failure Analysis of Electronic Assemblies

There are three major types of the interconnect in any electronic device or assembly: 

 

Connection between components and a board – Solder joints

 

Connection inside components – Solder joints or Wire bonds

 

Connection between various components – traces and Vias, connecting the traces

 

If the integrity of a single “link” in the interconnect chain is compromised –the device fails functionally. 

 

Defects in interconnects is by far the MAJOR reason for field returns. If a defect is not an obvious one (missing component, poor soldering, etc.), it can easily escape general type of inspection. 

 

Establishing the root cause of failure is an extremely complicated, yet fascinating task. In many instances, a case of FA is in essence a case of CSI – “Crime Scene Investigation”. In-depth knowledge of the assembly process, along with extensive experience within the industry, are a must have to succeed.  

  • Failure Analysis of Electronic Assemblies
  • Failure Analysis of Electronic Assemblies
  • Failure Analysis of Electronic Assemblies
  • Failure Analysis of Electronic Assemblies

Failure can be caused by: 

 

Material/component related issues 

 

Process related issues 

 

Customer abuse 

 

Improper handling 

 

Environmental exposure 

 

The following Tests/Analyses are typically involved to establish the root case: 

 

Visual inspection and X-ray Inspection 

 

Cross-sectioning and Parallel Lapping 

 

Scanning Electron Microscopy (SEM) 

 

Energy Dispersive X-ray Microanalysis (EDS)  

 

Fourier-Transform Infrared Spectroscopy (FTIR) 

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