There are three major types of the interconnect in any electronic device or assembly:
Connection between components and a board – Solder joints
Connection inside components – Solder joints or Wire bonds
Connection between various components – traces and Vias, connecting the traces
If the integrity of a single “link” in the interconnect chain is compromised –the device fails functionally.
Defects in interconnects is by far the MAJOR reason for field returns. If a defect is not an obvious one (missing component, poor soldering, etc.), it can easily escape general type of inspection.
Establishing the root cause of failure is an extremely complicated, yet fascinating task. In many instances, a case of FA is in essence a case of CSI – “Crime Scene Investigation”. In-depth knowledge of the assembly process, along with extensive experience within the industry, are a must have to succeed.