Failure Analysis of Electronic Components

Printed wiring boards are getting more sophisticated with multilayered (and often stacked) interconnects. At the same time, active and passive electronic components are becoming smaller and smaller while their design is getting more and more complicated, almost mimicking a stand-alone printed circuit board assembly on its own.  


Our extensive knowledge of various failure modes combined with our sets of high-tech equipment, allows us to successfully analyze and establish root cause of failure of components, rigid; rigid-flex and flex boards.

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