Plating Analysis

Plating plays a crucial role in preserving functionality and reliability as well as cosmetic appearance of plated components and parts. In many cases we can non-destructively measure composition and thickness of plating layer(s) and compare the data against a specification. Even extremely thin layers (a fraction of a micron) can be imaged and characterized using 

 

Scanning Electron Microscopy (SEM)

 

Energy Dispersive X-ray Microanalysis (EDS)  

 

X-ray Fluorescence (XRF) 

 

Light Microscopy 

 

Cross-sectioning 

  • Plating Analysis
  • Plating Analysis
  • Plating Analysis

What our clients say

  • "SENTEC’s industry knowledge, skills and responsiveness are second to none. It’s been a pleasure working with and learning from SENTEC’s team. When we need skilled micro-sectioning and analyses for electronic parts, SENTEC is our go-to!"

    - Gastops Ltd. Engineering Team

  • "SENTEC has what it takes to get down to the root cause of a problem. We use Science+ENgineering+TEChnology in our business and strongly believe it is the right combination for success."

    - Vladimir Igoshev, Sentec Testing Laboratory Inc.

  • "We have been very happy with the services provided by Sentec. There is excellent knowledge depth for the metallurgical problems associated with electronics manufacturing."

    - Bev Christian, Ph.D

  • "The analysis done by Sentec has been clearly superior to any work done at much larger companies. Their response times is excellent as is their ability to interface with out customers at a very high professional level. It is not uncommon now for your Fortune 100 customers to use SENTEC for other problem solving in lieu of their own internal resources."

    - Steve Kelly, President, PFC Flexible Circuits Limited

  • "The service received from SENTEC has been excellent in terms of responsiveness and technical analysis."

    - Kaspars Friebergs, Director of Quality, EPM Global Services Inc.