Soldering Workmanship Assessment

Soldering process is a crucial part of any electronic assembly. Even the process itself is incredibly old (there is evidence that soldering was employed as early as 5,000 years ago), its fundamentals have not changed. It requires formation of a proper layer of intermetallic at the solderable interface. Properly soldered parts/components can withstand the elements for many years providing reliable functionality.


Any manufacturer of electronic assemblies strives to ensure their soldering process results in production of robust devices. With introduction of lead-free solders due to RoHS requirements, new concerns with reliability of solder joints have emerged.

We have been involved in research of reliability of new Pb-free solders for over two decades and know enough to solve any potential issue with either switching to a Pb-free process or running it flawlessly. Whatever soldering technique is used (hand soldering; SMT; wave; selective; laser) we can assess its workmanship using


Visual inspection and X-ray Inspection


Cross-sectioning and Parallel Lapping


Scanning Electron Microscopy (SEM)


Energy Dispersive X-ray Microanalysis (EDS)



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