Soldering process is a crucial part of any electronic assembly. Even the process itself is incredibly old (there is evidence that soldering was employed as early as 5,000 years ago), its fundamentals have not changed. It requires formation of a proper layer of intermetallic at the solderable interface. Properly soldered parts/components can withstand the elements for many years providing reliable functionality.
Any manufacturer of electronic assemblies strives to ensure their soldering process results in production of robust devices. With introduction of lead-free solders due to RoHS requirements, new concerns with reliability of solder joints have emerged.